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STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT
(2021-05-09)
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables ...
STUDY OF INTERDIFFUSION AND GROWTH OF INTERMETALLIC COMPOUNDS IN BIMETALLIC LAYERS OF ALPHA BRASS AND Al-Mg ALLOY
(2020-08-17)
This work aims to study the formation of Inter Metallic Compounds (IMC’s) and their growth rate in Brass and Al-Mg alloy. This diffusion couple consists of four elements Aluminum, Copper, Zinc and Magnesium. Aluminum and ...