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Study of SAC Solder Interconnect Parameters in Microelectronic Semiconductor Packaging and their Effects on Electromigration Failure Mechanisms
(2021-12-13)
As the shrinkage of electronic devices becomes more appealing, so do their high capacity and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend predicted by Moore’s Law. To achieve ...
Assessment of Joule Heating Properties of Various Solder Alloys in BGA Assembly
(2023-05-22)
The continuing demands for smaller, yet higher performance devices have resulted in many revolutionary changes in device packaging in recent years, including the change in package form factors, structure, and the type of ...