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Effect Of Reflow Variables On The Nanoscale Mechanical Properties Of Lead Free Solders
(Materials Science & Engineering, 2010-07-19)
This study presents findings on the nano-mechanical properties of binary and ternary (Cu, Ag) - Sn Solders. Nanoindentation with a cube corner tip was used on Sn-Ag and SAC405 alloy compositions to investigate the effect ...