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Effects of Graphene in High-Density Polyethylene Microfibers
(2022-12-20)
High-Density Polyethylene uniquely can induce banded spherulites as it is crystallized from its melt. We studied the effects of graphene in the crystallography of banded HDPE by examining parameters such as the extent of ...
SYNTHESIS AND CHARACTERIZATION OF COBALT-BASED MAGNETIC NANOSTRUCTURES
(2020-08-18)
Co is an attractive element in the development of nanostructured magnetic materials due to its relatively high moment (1.72-1.75 µB) and strong exchange and spin-orbit interactions, and many of these materials have potential ...
Hierarchical microstructures to overcome the conflict between strength and toughness of hard coatings: TiN/Ni as a model system
(2022-07-13)
In the recent times, industry's production speed has been increasing and thus, the production of parts needs to adapt and so do the materials used to manufacture them. Hence, tools exposed to more extreme conditions using ...
SINGLE STEP FABRICATION OF SHAPE MORPHING 3D SURFACES
(2020-06-04)
Shape-changing materials that can adopt programmable 3-dimensional (3D) shapes offer promise for a wide range of applications. Form the formation of the leaves and flowers to the shaping of complex organs, the analogues ...
Study on Forming DNA-Mediated Nanoparticle Conjugates: Toward Detection of COVID-19
(2021-12-21)
The objective of this thesis is to establish a rapid, robust, and reproducible procedure to controllably assemble DNA-functionalized Au nanoparticles (AuNPs) into satellite-shaped nanostructures using sequence-specific DNA ...
Study of SAC Solder Interconnect Parameters in Microelectronic Semiconductor Packaging and their Effects on Electromigration Failure Mechanisms
(2021-12-13)
As the shrinkage of electronic devices becomes more appealing, so do their high capacity and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend predicted by Moore’s Law. To achieve ...
STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT
(2021-05-09)
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables ...
CHARACTERIZATION OF ASPHALT/RECYCLED PLASTIC BLENDS MODIFIED BY EXFOLIATED CLAY NANOPLATELETS
(2021-05-09)
There is a renewed interest from federal and state transportation agencies as well as the asphalt industry in developing successful utilization of recycled plastics in asphalt pavements. By incorporating a third material ...
The Effects of SnAgCu Solder Interconnect Package’s Parameters on Electromigration Failure Mechanisms
(2021-12-17)
The primary concern of this dissertation is the electromigration (EM) failure mechanism found in Sn-Ag-Cu (SAC) solder alloys integrated in WCSP (wafer-level chip scale package) packaging structure and factors affecting ...
METAL NANODENDRITES AND THEIR APPLICATIONS AS 3D SURFACE ENHANCED SCATTERING (SERS) SUBSTRATES
(2021-05-26)
Ultrasensitive detection of chemicals and biological analytes has been a focus of a lot of studies in the recent years. In this search for the versatile detection technique, Surface Enhanced Raman Spectroscopy (SERS) has ...