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Study On The Leakage Current Behavior And Conduction Mechanism Of Porous Low-k In Cu/porous Low-k Interconnects: The Influence Of Extrinsic Factors
(Materials Science & Engineering, 2010-11-01)
This study investigates the influence of extrinsic factors including moisture and impurities trapped in porous low-k (PLK) and defective diffusion barrier on the leakage current behavior and the associated conduction ...