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dc.contributor.authorDeshmukh, Ruddhi Shashikumaren_US
dc.date.accessioned2014-09-17T17:27:37Z
dc.date.available2014-09-17T17:27:37Z
dc.date.issued2014-09-17
dc.date.submittedJanuary 2014en_US
dc.identifier.otherDISS-12827en_US
dc.identifier.urihttp://hdl.handle.net/10106/24690
dc.description.abstractThe ever increasing information technology heat load and data center cooling energy are the main reasons to investigate the performance of microencapsulated phase change slurry over other heat transfer fluids. In recent years, more effort is being made on the development of a new technique to use the phase change materials as pump-able heat transfer fluid and as heat storage system. Thermal Energy Storage (TES) using Phase Change Materials for data centers offers a very effective method of cutting electric power costs for owners and easing demand on the power grid. Thermal storage systems have been around for decades and include various components and methods to store and retrieve pre-cooled medium. PCM storage has been popular in large commercial applications located in regions with high peak (day time) utility energy costs and a much lower off-peak (night time) cost.Microencapsulated phase change slurry is dispersion where the phase change material, microencapsulated by a polymeric capsule, is dispersed in water. Compared to water, these new fluids have a higher heat capacity during phase change and a possible enhancement, as a result of this phase change, in the heat transfer phenomenon. The composition of phase change material used in slurry greatly affects its efficiency, If not selected properly it can cause serious damage, e.g. agglomeration and clogging of pipes. Current available systems use microencapsulated phase change slurry with heat exchangers. The objective of this project is to design and fabricate a shell- tube, phase change material (PCM) based heat exchanger, which can act as a thermal energy storage device, to increase the energy efficiency and hence can be incorporated in data center cooling.en_US
dc.description.sponsorshipAgonafer, Derejeen_US
dc.language.isoenen_US
dc.publisherMechanical Engineeringen_US
dc.titleData Center Cooling Augmentation Using Micro-encapsulated Phase Change Materialen_US
dc.typeM.S.en_US
dc.contributor.committeeChairAgonafer, Derejeen_US
dc.degree.departmentMechanical Engineeringen_US
dc.degree.disciplineMechanical Engineeringen_US
dc.degree.grantorUniversity of Texas at Arlingtonen_US
dc.degree.levelmastersen_US
dc.degree.nameM.S.en_US


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