Browsing Department of Mechanical and Aerospace Engineering by Title
Now showing items 734-753 of 916
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Rack Level Study of Hybrid Cooled Servers Using Warm Water Cooling with Variable Pumping for Centralized Coolant System
(2017-05-24)As the worldwide demand for the data centers grows, so does the size and load placed on data centers which leads to the applied constraints on power and space available to the operator. Cooling power consumption is a major ... -
REACHABLE SET COMPUTATION AND ANALYSIS FOR PERTURBED LINEAR SYSTEMS
(2018-12-04)Determination of the set of all possible states, which a system can attain, plays an important role in safety for critical application. Prior knowledge of this set for the complete run-time provides critical information ... -
Reactive Motion Planning of Autonomous Vehicles in 3-Dimensional Environments using Collision and Rendezvous Cones
(2022-08-15)This dissertation presents a collision cone/rendezvous cone-based approach for reactive motion planning in three-dimensional dynamic environments. Collision avoidance is fundamental to robot motion planning. In dynamic ... -
Real Time Temperature Prediction In A Data Center Environment Using An Adaptive Algorithm
(Mechanical Engineering, 2014-03-12)Most organizations around the world rely on information systems to run their operations. Data centers are hence a crucial aspect of most organizational operations to ensure business continuity. Disruption in the working ... -
REAL-TIME MATERIAL STATE ASSESSMENT OF COMPOSITES USING ARTIFICIAL INTELLIGENCE AND ITS CHALLENGES
(2021-05-09)Over several decades of careful experimental investigation and exhaustive development of discrete damage analysis methods including integrated computational mechanics methods, our community knows a great deal about how ... -
Real-time Minimum Jerk Optimal Trajectory Synthesis and Tracking for Ground Vehicle Applications
(2018-01-08)Research on wheeled mobile robots has been an active research field for several decades with focus on the problems of stability, maneuverability and control. The trajectory generation for wheeled mobile robots is usually ... -
Reanalysis For Static And Steady State Structure Response
(Mechanical Engineering, 2011-03-03)Reanalysis of a structure has become very important in structural analysis, as it reduces the cost and the computational time required to measure the response of the structure after it has been modified. As the importance ... -
RECONFIGURABLE ELECTROCHEMICAL BIOSENSOR ENABLED BY DIGITAL MICROFLUIDIC DEVICES
The increasing demand for improving the health care quality in developed countries with synchronous advances in the microfabrication of CMOS devices results in the emergence of the Lab-on-a-chip (LOC) field. The ultimate ... -
Reduced Order Modeling Of Low-temperature Gas Discharges In Glow Mode
(Aerospace Engineering, 2014-12)Gas discharge actuation of fluid dynamics phenomena has garnered significantattention in recent years due to their low-power requirements andtheir geometrical simplicity, amongst others. However, many of their actuationmechanisms ... -
Reduced-order Analysis Of Dual Mode Supersonic Combustion Ramjet Propulsion System
(Aerospace Engineering, 2015)High speed propulsion systems typically possess relatively simple geometry but the complexity involved in the flow characteristics makes their analysis a challenging task. The current research work introduces a reduced ... -
Region Based Convolutional Neural Networks for object detection and recognition in ADAS application
(2018-02-15)Object Detection and Recognition using Computer Vision has been a very interesting and a challenging field of study from past three decades. Recent advancements in Deep Learning and as well as increase in computational ... -
Reinitiation Mode Study of Highly Irregular Detonation
(2020-06-03)The propagation of detonation waves is governed by their stability characteristics. Interest in highly unstable detonation grew when early experiments revealed limits of operation to be directly proportional to the stability ... -
RELATING LINEAR AND ROTATIONAL ACCELERATIONS WITH INTERNAL PRESSURES DEVELOPED INSIDE HUMAN HEAD SURROGATE MODELS
(2021-12-21)Traumatic Brain Injury (TBI) is a chronic disease process that is difficult to both detect and treat. TBI can result from blast, kinetic, sonic, and electromagnet energy sources. This research focuses on correlating the ... -
RELIABILITY ASSESSMENT OF SOLDER JOINT INTERCONNECTS OF BGA PACKAGE-MEGTRON SERIES UNDER POWER CYCLING
(2017-12-11)Solder joint interconnects are the second level assembly in surface mount interconnection technology. Mismatch in the coefficient of thermal expansion (CTE) between package and substrate or PCB creates failure in solder ... -
RELIABILITY ASSESSMENT OF SOLDER JOINT USING BGA PACKAGE – MEGTRON 6 VERSUS FR4 PRINTED CIRCUIT BOARDS
(2017-05-24)When it comes to the mechanical and electrical seam of the Printed Circuit Board (PCB) and package, reliability of the board plays a major impact on PCB. As the frequency increases, losses in signals increase. This ... -
RELIABILITY ASSESSMENT OF SOLDER JOINT USING BGA PACKAGE – MEGTRON 6 VERSUS FR4 PRINTED CIRCUIT BOARDS USING DROP TESTING
(2018-01-09)In electronic industry Ball grid array (BGA) package, surface mount technology has been used widely, due to its robust design, high density connections and improved performance. In surface mount technology, solder joints ... -
RELIABILITY CHALLENGES IN AIRSIDE ECONOMIZATION AND OIL IMMERSION COOLING
(2016-05-16)The Datacom facility which comprises rooms or closets used for communication, computers/servers or electronic equipment requires cooling unit which consumes 31% (23% HVAC cooling + 8% HVAC fans) of overall energy. The ... -
RELIABILITY ENHANCEMENT OF HETEROGENEOUS 3D INTEGRATED CIRCUIT AND CHARACTERIZATION OF THERMAL INTERFACE MATERIAL
(2020-08-28)Electronic products require high functional integration in small footprints with lower cost. At the same time, it is required to maintain effective communication between the IC’s and the electronic systems. Various challenges ... -
Reliability of a 2.5D TSV package
(2018-08-13)In the recent years, the Through Silicon Vias (TSVs) are helping a huge variety of the 3D IC and the 2.5D IC packaging applications to try to fulfill their requirements of functionality and higher connectivity at the expense ... -
Reliability Of Lead-free Solder Under Cyclic Bending
(Mechanical Engineering, 2007-08-23)To characterize particular compositions of lead free solder, four point cyclic bending test was conducted to study the affects of accelerated stress testing on the package to board interconnects. Nine CTBGA packages with ...