Browsing Department of Mechanical and Aerospace Engineering by Subject "Failure analysis"
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SOLDER JOINT DESIGN OPTIMIZATION OF QUAD-FLAT PACKAGE WITH GULLWING LEADS UNDER ACCELERATED THERMAL CYCLING AND POWER CYCLING
(2018-07-10)Ever growing complexity in designing of Integrated Circuits and accommodating high number of Interconnections in the device is the main source of motivation in today’s world of IC devices. Quad Flat Package (QFP) with ...