Browsing Department of Mechanical and Aerospace Engineering by Subject "Material characterization"
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Computational Analysis of Impact Loading on Wafer Level Chip Scale Packages Mounted on Printed Circuit Boards of Varying Thickness
(2016-05-10)In the electronic industry one of the popular package is Chip Scale Package (CSP) due to its small form factor and low cost. To meet the need of new functionality and portability of the recent devices, CSPs’ have been most ... -
Material Characterization and Fracture Prediction of FDM Printed Parts
(2019-11-18)In order to take advantage of the design freedom that Additive Manufacturing offers, most applications require reliable material characterization. This can ensure that a design performs within its environment and life ...