Browsing Department of Mechanical and Aerospace Engineering by Subject "Temperature"
Now showing items 1-2 of 2
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IMPROVING THE IMPINGEMENT COLD PLATE THERMAL DESIGN USING NUMERICAL AND ANALYTICAL APPROACH
(2021-05-15)Conventional cooling methods for an IC chip uses heat spreader to transfer heat from the chip end of the spreader to the opposite end of the spreader which then uses air or water to remove heat and thereby maintaining the ... -
THERMAL DESIGN ANALYSIS OF SERVER CHASSIS MANIFOLDS FOR LIQUID COOLED SERVERS USING CFD
(2021-05-18)Direct-to-chip liquid cooling is one of the most popular methods in data center thermal management when it comes to cooling high chip power densities. A cold plate-based liquid cooling system contains various components ...