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Computational Analysis of Impact Loading on Wafer Level Chip Scale Packages Mounted on Printed Circuit Boards of Varying Thickness
(2016-05-10)
In the electronic industry one of the popular package is Chip Scale Package (CSP) due to its small form factor and low cost. To meet the need of new functionality and portability of the recent devices, CSPs’ have been most ...
Quality Assessment of Adhesive Bond Based On Dielectric Properties
(Society of the Advancement of Material and Process Engineering (SAMPE), 2017)
Composite materials are widely used in Aerospace, Marine and Automotive structures to reduce weight and increase performance. Adhesive bonding improves the stress distribution between the composite materials / dissimilar ...