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MULTI-PHYSICS DESIGN OPTIMIZATION OF 2D AND ADVANCED HETEROGENOUS 3D INTEGRATED CIRCUITS
(2018-08-27)
The convergence and miniaturization of computing and communications dictate building up rather than out. As planar device miniaturization continues to its ultimate limits, the complexity of circuit interconnections for 2-D ...
Chip Package Interaction Study To Analyze The Mechanical Integrity Of A 3-D TSV Package
The convergence and miniaturization of computing and communications dictates building up rather than out. As planar device miniaturization continues to its ultimate limits, the complexity of circuit interconnections for ...