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OPTIMIZATION OF BOARD LEVEL RELIABILITY OF MICROELECTRONIC PACKAGES AND MODULES
(2018-08-28)
Thermo-mechanical reliability estimation of electronic packages and modules provides an opportunity to predict the function life of semiconductor devices. The problem complexity lies in the fact that there are variety of ...
Impact of Layer Thickness of QFN Package Mounted Printed Circuit Boards During Drop Testing
(2015-12-17)
In past studies, it was established that board level reliability of the packages depends mainly upon the design of the package and the soldering technology used for mounting the components. There are many methods to test ...