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STUDY OF CRACK PROPAGATION UNDER THERMAL LOADING ON A 3D TSV PACKAGE
(2016-09-16)
Today, there is a revolution in going for miniaturization in size of electronic packages. More thinner, lighter and complex packages are in use for almost every electronic device. This initiation was taken to the next level ...
Computational Morphology Modelling and Mixed Mode Fracture Analysis of ZrB2/SiC Based Ceramic Nano-materials Using Molecular dynamics
(2018-01-09)
Transition metal carbides, nitrides, and borides are a group of Ultra High-Temperature Ceramic (UHTC). Owing to their remarkable properties of the high melting point, high thermal conductivity and excellent strength at ...
PREDICTING CRACK INITIATION AND EARLY CRACK GROWTH BEHAVIOR OF PURE NICKEL USING SURFACE TOPOGRAPHY ANALYSIS
(2019-08-19)
Fatigue has long been studied as the most critical loading mode for man-made structures. Despite the advances in material behavior characterization and numerical calculation, many structures unexpectedly fail before their ...
High Magnification Surface Topography based Digital Image Correlation (DIC) for Identifying Damage Accumulation and Crack Growth in Polycrystalline Nickel
(2023-08-09)
Damage index parameters that have been formulated to identify damage localization in plastically deformed materials typically require all six stress or strain components. Recently, simulations through Crystal Plasticity ...