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Computational Analysis of Impact Loading on Wafer Level Chip Scale Packages Mounted on Printed Circuit Boards of Varying Thickness
(2016-05-10)
In the electronic industry one of the popular package is Chip Scale Package (CSP) due to its small form factor and low cost. To meet the need of new functionality and portability of the recent devices, CSPs’ have been most ...
IMPROVING THE IMPINGEMENT COLD PLATE THERMAL DESIGN USING NUMERICAL AND ANALYTICAL APPROACH
(2021-05-15)
Conventional cooling methods for an IC chip uses heat spreader to transfer heat from the chip end of the spreader to the opposite end of the spreader which then uses air or water to remove heat and thereby maintaining the ...
FORMATION FLIGHT FOR FUEL SAVING IN CORONET MISSIONS OF KC-135R AND F-15C/E
(2016-12-21)
The fuel saving benefit of formation flight has been demonstrated through theoretical and computational analyses, simulation, wind tunnel and flight tests. When an aircraft flies in a specific region in the wake of another ...
Investigation of Exothermic Reaction Dynamics via Computational Fluid Dynamics Coupled with a Feedback Controller
(2016-08-29)
The control of reaction temperature under continuous flow conditions is important in a variety of chemical manufacturing industries. For many reactions, operating at off-design temperatures can result in the production of ...
AN INVASTIGATION OF BAND-LIMITED FLUID DAMPER CONFIGURATION USING LUMPED PARAMETER MODELING
(2015-12-10)
Vehicle suspension system is one of the key factors related to the vehicle dynamic characteristic. The fine tuning of suspension system between vehicle handling and ride comfort is not only a trade-off between these two ...