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On the Enhancement of Thermo-Mechanical and Impact Reliability of Passive and Active Microelectronic Devices
(2016-09-16)
Microelectronic devices are an essential part of human life. The idea of Internet of Things (IoT) where all the everyday devices will be connected with each other transmitting information and operating on their own is ...
MULTI-PHYSICS DESIGN OPTIMIZATION OF 2D AND ADVANCED HETEROGENOUS 3D INTEGRATED CIRCUITS
(2018-08-27)
The convergence and miniaturization of computing and communications dictate building up rather than out. As planar device miniaturization continues to its ultimate limits, the complexity of circuit interconnections for 2-D ...
RELIABILITY ASSESSMENT OF SOLDER JOINT INTERCONNECTS OF BGA PACKAGE-MEGTRON SERIES UNDER POWER CYCLING
(2017-12-11)
Solder joint interconnects are the second level assembly in surface mount interconnection technology. Mismatch in the coefficient of thermal expansion (CTE) between package and substrate or PCB creates failure in solder ...