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STUDY OF CRACK PROPAGATION UNDER THERMAL LOADING ON A 3D TSV PACKAGE
(2016-09-16)
Today, there is a revolution in going for miniaturization in size of electronic packages. More thinner, lighter and complex packages are in use for almost every electronic device. This initiation was taken to the next level ...
Effect of Dielectric Inter-layer in Performance of the Multi-functional Material in Mechanical, Thermal and Environmental Loading Conditions
(2019-05-10)
The demand for Electrical power storage devices for space shuttle, aircraft, car, bus and marine vehicles increased a great deal to have a greener and safer world. Decades of research has been done on development of light ...