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IMPROVING THE IMPINGEMENT COLD PLATE THERMAL DESIGN USING NUMERICAL AND ANALYTICAL APPROACH
(2021-05-15)
Conventional cooling methods for an IC chip uses heat spreader to transfer heat from the chip end of the spreader to the opposite end of the spreader which then uses air or water to remove heat and thereby maintaining the ...
CHARACTERIZATION OF A COLD PLATE BY EXPERIMENTAL ANALYSIS AND POWER SAVINGS CALCULATION OF DYNAMIC COLD PLATE
(2018-05-23)
Cooling is a critical part of data center’s infrastructure, and with ongoing demands in data processing and storage, thermal management issues are of great concern. Some imperative methods of removing heat are either using ...
Thermal Optimization and Validation of GaN High Electron Mobility Transistor
(2017-06-08)
Gallium Nitride (GaN) is a binary III/V wide band gap semiconductor used in power electronics for operations at high power densities and high speeds. GaN has excellent characteristics like high break-down voltage, high ...
CFD MODELLING OF WET COOLING MEDIA AND DESIGN OPTIMIZATION OF HEAT SINK FOR DATA CENTER APPLICATION
(2016-05-12)
Air cooling is most widely used and economical method of currently available cooling technologies in which heat exchanger plays a vital role in facility designs. Evaporative cooling can be energy efficient than mechanical ...