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RELIABILITY ASSESSMENT OF SOLDER JOINT USING BGA PACKAGE – MEGTRON 6 VERSUS FR4 PRINTED CIRCUIT BOARDS
(2017-05-24)
When it comes to the mechanical and electrical seam of the Printed Circuit Board (PCB) and package, reliability of the board plays a major impact on PCB. As the frequency increases, losses in signals increase. This ...
MEASUREMENT OF CHANGE IN CTE OF PCBS DUE TO SINGLE PHASE IMMERSION COOLING AND IMPACT OF CHANGED PROPERTIES OF PCBS ON SOLDER JOINT RELIABILITY OF BGA PACKAGE
(2020-06-05)
Oil immersion cooling in high-density data centers is emerging as an alternative for traditional air cooling because of the less power consumption, capacity to handle high power density and less space requirement. To adopt ...