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IMPACT OF MATERIAL MODELS ON IMMERSION COOLED ELECTRONICS PACKAGES AND RELIABILITY ASSESSMENT FOR CHIP-PACKAGE INTERACTION
(2021-05-13)
The immersion cooling for IT equipment has been around for decades. From thermal energy management perspective, immersion cooling is better than traditional cooling technology. However, there is need for more work in open ...
ANALYSIS OF GLASS TRANSITION TEMPERATURE OF PCB & SUBSTRATE USING DYNAMIC MECHANICAL ANALYSIS & THERMOMECHANICAL ANALYSIS
(2020-12-22)
Electronic Packaging materials and their properties examines the array of packaging
architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Glass transition ...
IMPACT OF VISCOELASTIC PROPERTIES OF LOW LOSS PRINTED CIRCUIT BOARDS (PCBs) ON RELIABILITY OF WCSP PACKAGES UNDER DROP TEST
(2020-06-08)
Reliability of electronic packages is a major concern as different failure modes are induced due to factors such as temperature loads, mechanical stresses, humidity, corrosion and so on. Finite element analysis (FEA) is ...