Browsing Dissertations & Theses by Subject "material characterization, dynamic mechanical analysis, thermo-mechanical analysis, thermal expansion coefficient, modulus, reliability, thermal/mechanical simulation & characterization - thermal/Mechanical modeling at component / board / system level"
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Investigation of the Impact of Material Models on Reliability Assessment of Electronic Packages
(2020-08-13)Drop testing, thermal cycling, power cycling, etc. are some of the tests used to assess the reliability of new electronic products. However, performing experimental study of every new design is costly and time consuming. ...