Browsing MS Theses - DO NOT EDIT by Author "Rajashekar, Karthik"
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Impact Of Viscoelastic Material Characterization Of PCB's On Thermomechanical Properties Of QFN Thick Package Under Thermal Cycling
Rajashekar, Karthik (Mechanical Engineering, 2015)The QFN component package is a quad flat pack (QFP) with “no-leads”, where the electrical contact to the printed circuit board (PCB) is made through soldering of the lands underneath the package body rather than the ...