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Pool Boiling Heat Transfer Characteristics Of Nanofluids And Nanocoatings
(Mechanical Engineering, 2010-03-03)
This research is a qualitative and quantitative investigation to understand the behaviors of nanofluids and nanocoated surfaces during pool boiling heat transfer. The pool boiling behavior of low concentration nanofluids, ...
Topology Optimization Using Hyper Radial Basis Function Network
(Mechanical Engineering, 2010-03-03)
Topology optimization has been conventionally used in automobile and aerospace industries to produce lightweight structures for minimum compliance or maximum fundamental frequency. Today, topology optimization finds ...
Effect Of Structural Design Parameters On Wafer Level CSP Ball Shear Strength And Their Influence On Accelerated Thermal Cycling Reliability
(Mechanical Engineering, 2010-07-19)
Wafer level chip scale package (WLCSP) is one of the most popular packages due to its size and cost advantages. It is expected that the usage of WLCSP in microelectronics and MEMS industry combined is going to cross 16000 ...
Analysis Of Data Center Cooling Strategies And The Impact Of The Dynamic Thermal Management On The Data Center Efficiency
(Mechanical Engineering, 2010-03-03)
The power trend for Server systems continues to grow thereby making thermal management of Data centers a very challenging task. Although various configurations exist, the raised floor plenum with Computer Room Air Conditioners ...
A Unified Analysis Of Stiffener Reinforced Composite Beams With Arbitrary Cross-section
(Mechanical Engineering, 2010-03-03)
A number of methods are available to analyze the laminated composite beams using smear property of laminate stiffness ignoring unsymmetrical behavior of laminates. Some include their effect of laminate but did not include ...
Aircraft Conceptual Design - An Adaptable Parametric Sizing Methodology
(Aerospace Engineering, 2010-07-19)
Aerospace is a maturing industry with successful and refined baselines which work well for traditional baseline missions, markets and technologies. However, when new markets (space tourism) or new constrains (environmental) ...
Effective Thermal Management Of Electronic Devices From System To Die Level
(Mechanical Engineering, 2010-07-19)
In any electronic device, the resistance to the flow of current through the transistors, interconnects, etc. results in a significant heat generation. If this heat is not removed from the device by providing appropriate ...