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Study of Conduction Behavior in Dielectrics in Chip Level Interconnects: Detection of Defects in Al/SiO2 Interconnects
(2018-12-18)
This dissertation presents four different electrical measurement techniques to detect structural defects in Al/SiO2 interconnects. These techniques, namely 1) polarity dependence measurement, 2) current voltage measurement, ...
Study of SAC Solder Interconnect Parameters in Microelectronic Semiconductor Packaging and their Effects on Electromigration Failure Mechanisms
(2021-12-13)
As the shrinkage of electronic devices becomes more appealing, so do their high capacity and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend predicted by Moore’s Law. To achieve ...
STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT
(2021-05-09)
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables ...
Assessment of Joule Heating Properties of Various Solder Alloys in BGA Assembly
(2023-05-22)
The continuing demands for smaller, yet higher performance devices have resulted in many revolutionary changes in device packaging in recent years, including the change in package form factors, structure, and the type of ...