Browsing MS Theses - DO NOT EDIT by Author "Gu, Huandi"
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Interfacial Reaction Of Sn-based Solder Joint In The Package System
Gu, Huandi (Materials Science & Engineering, 2014-09-17)Now a day in electronic industry, as the trend of requiring smaller package size with better electronic performance, lead-free solder joints are always required to decrease their sizes. As a result, the reliability of ...