Browsing MS Theses - DO NOT EDIT by Author "Kim, Choong-Un"
Now showing items 1-7 of 7
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Assessment of Joule Heating Properties of Various Solder Alloys in BGA Assembly
Le, Jimmy-Bao D (2023-05-22)The continuing demands for smaller, yet higher performance devices have resulted in many revolutionary changes in device packaging in recent years, including the change in package form factors, structure, and the type of ... -
Effect Of Aging On The Transformation Of Phases In Solder Joint Of PBGA Packaging
Kim, Jeong-Min (Materials Science & Engineering, 2010-07-19)This study investigates the microstructural characteristics of 3.0Ag-0.5Cu-Sn (SAC305) solder joint as in assembled state, and their evolution with aging treatment at 100 and 150°C for various hours. Specific aim of the ... -
Enhanced Mechanical Stability Of Interlayer Dielectrics With Self-organized Molecular Pores
Pandey, Akanksha (Materials Science & Engineering, 2015)In order to reduce resistance-capacitance delays in interconnect structures, ultralow-k films are used as interlayer dielectric materials. In most cases the preferred method to achieve the lower dielectric constant is the ... -
Influence of the Volume-Contact Area Ration on the Growth Behavior of the Cu-Sn Intermetallic Phase
Giddaluri, Venkatakamakshi Supraja; 0000-0002-6913-9727 (2015-12-21)Solder Joints play a very important role in electronic packaging industry by serving as mechanical support and provides integrity to the device. The increasing demand for high performance, environmental and economic ... -
INTERFACE REACTION INDUCED STRESS DEVELOPMENT IN AN ALUMINUM THIN FILM COPPER BULK PLATE DIFFUSION COUPLE
Mishler, Michael Codie (2015-12-18)This thesis investigates the mechanism of the interface reaction induced intermetallic phase formation (IMC) and its impact on the interface reliability in Al-Cu diffusion couple pairing. This study is motivated by the ... -
INVESTIGATION OF SURFACE CONTAMINATION IN A Cu-BASED Al ALLOY OCCURRING DURING TEM SAMPLE PREPARATION
Claunch, Kelly (2018-08-17)This thesis investigates the nature of surface contamination originating from the jet-polishing process on Cu-6 wt% Al TEM disks. During previous TEM imaging and diffraction analysis performed by our group, surface ... -
STUDY OF INTERDIFFUSION AND GROWTH OF INTERMETALLIC COMPOUNDS IN BIMETALLIC LAYERS OF ALPHA BRASS AND Al-Mg ALLOY
Kota, Ratan; 0000-0003-3917-9856 (2020-08-17)This work aims to study the formation of Inter Metallic Compounds (IMC’s) and their growth rate in Brass and Al-Mg alloy. This diffusion couple consists of four elements Aluminum, Copper, Zinc and Magnesium. Aluminum and ...