Browsing MS Theses - DO NOT EDIT by Author "Kim, Jeong-Min"
Now showing items 1-1 of 1
-
Effect Of Aging On The Transformation Of Phases In Solder Joint Of PBGA Packaging
Kim, Jeong-Min (Materials Science & Engineering, 2010-07-19)This study investigates the microstructural characteristics of 3.0Ag-0.5Cu-Sn (SAC305) solder joint as in assembled state, and their evolution with aging treatment at 100 and 150°C for various hours. Specific aim of the ...