Liquid Cooling Of A High-power Multi-chip Module Using A Sectioned Cold Plate

Abstract

With the advancement in micro-fabrication techniques and high performance chips, the heat flux generated through these electronics is reaching a point where air-cooling of these devices is not efficient enough. By definition, Multi-Chip Modules (MCMs) are specialized electronic packages where multiple Integrated-Circuits (ICs) and semiconductor dies are unified onto a single substrate. Increasing advancements in ICs enable MCMs as alternate packaging finding its application in high power electronics like power generation and cooling, medical devices, lasers and, military electronics etc. Hence, liquid cooling techniques are explored as possible solutions. In this study, a high power MCM is considered and, its cooling requirements are met with a sectioned cold plate with each chip in the arrangement having their own individual flow conduits. The dimensions of the cold plate were parameterized within the basic design constraints. An optimum design of the flow guide was used to address the mal-distribution of the flow for the present impingement of the flow arrangement. The design was also studied for various dimensions of commercially available barb fittings at the inlet for various flow rates. The results calculated, using CFD, showed significant improvements over the conventional cold plate and the operating conditions of the MCM were efficiently maintained.