Browsing by Author "Kim, Choong-Un"
Now showing items 1-20 of 25
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Achieving novel functionalities in semiconductor-crystalline oxide heterostructures through electrical and structural coupling
Ahmadi-Majlan, Kamyar (2018-08-15)Creating new materials that exhibit enhanced or novel behaviors is essential to meet the technological challenges we face today. Complex oxides are perfect candidates to overcome these challenges due to the range of ... -
Assessment of Joule Heating Properties of Various Solder Alloys in BGA Assembly
Le, Jimmy-Bao D (2023-05-22)The continuing demands for smaller, yet higher performance devices have resulted in many revolutionary changes in device packaging in recent years, including the change in package form factors, structure, and the type of ... -
Effect Of Aging On The Transformation Of Phases In Solder Joint Of PBGA Packaging
Kim, Jeong-Min (Materials Science & Engineering, 2010-07-19)This study investigates the microstructural characteristics of 3.0Ag-0.5Cu-Sn (SAC305) solder joint as in assembled state, and their evolution with aging treatment at 100 and 150°C for various hours. Specific aim of the ... -
ELECTROMIGRATION INDUCED INTERFACE REACTION IN Cu-WIRE / Al-PAD DIFFUSION COUPLE
Rodriguez-Salazar, Patricia Aracelly; 0000-0001-9651-2382 (2017-01-17)This dissertation presents experimental observations that may assist the understanding of electromigration (EM) failure mechanism active in Cu wire and Al thin film pad (wire bond). This study is motivated by an ongoing ... -
Enhanced Mechanical Stability Of Interlayer Dielectrics With Self-organized Molecular Pores
Pandey, Akanksha (Materials Science & Engineering, 2015)In order to reduce resistance-capacitance delays in interconnect structures, ultralow-k films are used as interlayer dielectric materials. In most cases the preferred method to achieve the lower dielectric constant is the ... -
Grain Structure Evolution Of Tin-based Lead-free Solder Joints In Electronic Packaging Assembly And Its Impact On The Fatigue Reliability
Xu, Huili (Materials Science & Engineering, 2014-03-12)Solder is one of the main joints materials used in the electronics for decades of years. It is not only the mechanical support but also conducts the electric signals in the electronics. However, the regulation of lead ... -
Influence of the Volume-Contact Area Ration on the Growth Behavior of the Cu-Sn Intermetallic Phase
Giddaluri, Venkatakamakshi Supraja; 0000-0002-6913-9727 (2015-12-21)Solder Joints play a very important role in electronic packaging industry by serving as mechanical support and provides integrity to the device. The increasing demand for high performance, environmental and economic ... -
An Innovative Epitaxial Growth Method For Minimizing Dislocations In Thin-film Quantum-dot Optoelectronic And Photovoltaic Device Applications
Gandhi, Jateen (Materials Science & Engineering, 2012-07-25)A new buffer layer method for epitaxial growth of lattice-mismatched semiconductor quantum-dots based p-i-n structures is presented. To our knowledge this is the first instance of a dislocation-reduction approach that ... -
INTERFACE REACTION INDUCED STRESS DEVELOPMENT IN AN ALUMINUM THIN FILM COPPER BULK PLATE DIFFUSION COUPLE
Mishler, Michael Codie (2015-12-18)This thesis investigates the mechanism of the interface reaction induced intermetallic phase formation (IMC) and its impact on the interface reliability in Al-Cu diffusion couple pairing. This study is motivated by the ... -
INVESTIGATION OF SURFACE CONTAMINATION IN A Cu-BASED Al ALLOY OCCURRING DURING TEM SAMPLE PREPARATION
Claunch, Kelly (2018-08-17)This thesis investigates the nature of surface contamination originating from the jet-polishing process on Cu-6 wt% Al TEM disks. During previous TEM imaging and diffraction analysis performed by our group, surface ... -
INVESTIGATION OF THE PLASMA ELECTROLYTIC OXIDATION MECHANISM OF TITANIUM
Mortazavi, GolsaPlasma electrolytic oxidation (PEO) is an environmentally friendly technology capable of forming coatings with excellent adhesion strength at high deposition rates. The PEO process is particularly attractive for forming ... -
INVESTIGATION OF THE SURFACE TOPOLOGY CHANGES ASSOCIATED WITH FATIGUE
Kelton, Randall D; 0000-0002-8476-5400 (2019-05-17)Metals have long been known to change their surface topology when subjected to a plastic strain. Given that a plastic zone exists at the tip of a propagating crack, it would seem natural to quantitatively study surface ... -
Investigation On The Mechanism Of Interface Electromigration (EM) In Copper (Cu) Thin Films
Kim, Jee Yong (Materials Science & Engineering, 2007-08-23)This study concerns the mechanism of the interface electromigration (EM) in copper (Cu) thin films. While EM in Cu is one of the most concerned reliability failure phenomena in Cu interconnects used microelectronic devices, ... -
Investigation On Thermo-mechanical Instability Of Porous Low Dielectric Constant Materials
Zin, Emil Hyunbae (Materials Science & Engineering, 2013-03-20)This study investigates the structural stability of porous low dielectric constant materials (PLK) under thermal and mechanical load and the influence of contributing factors including porosity as intrinsic factor and ... -
Mechanical Reliability Of Porous Low-k Dielectrics For Advanced Interconnect: Study Of The Instability Mechanisms In Porous Low-k Dielectrics And Their Mediation Through Inert Plasma Induced Re-polymerization Of The Backbone Structure
Sa, Yoonki (Materials Science & Engineering, 2015)Continuous scaling down of critical dimensions in interconnect structures requires the use of ultralow dielectric constant (k) films as interlayer dielectrics to reduce resistance-capacitance delays. Porous carbon-doped ... -
METAL NANODENDRITES AND THEIR APPLICATIONS AS 3D SURFACE ENHANCED SCATTERING (SERS) SUBSTRATES
Athavale, Aseem; 0000-0002-0674-0232 (2021-05-26)Ultrasensitive detection of chemicals and biological analytes has been a focus of a lot of studies in the recent years. In this search for the versatile detection technique, Surface Enhanced Raman Spectroscopy (SERS) has ... -
Nano-morphology Of Polymer Bulk Herojunctions Studied By Time-resolved Synchrotron X-ray Scattering
Kim, Soo (Materials Science & Engineering, 2014-03-12)This study investigates the phase transformation of an active layer in organic photovoltaics (OPV) during film deposition and post thermal treatment as well as effects of phase transformation on OPV performance. For this ... -
PHYSICAL MODELING OF FILAMENT GROWTH AND RESISTIVE SWITCHING IN METAL OXIDE-BASED RRAM
Zhang, Kena; 0000-0003-4796-8097 (2022-12-15)Metal oxide-based resistive random-access memories (RRAM) exhibit several excellent performances, such as nanosecond switching speed, large write-erase endurance, and long retention time, and can potentially replace the ... -
Simulation And Development Of Nanoscale Deposition Techniques Using Kinetic Monte Carlo
Clark, Corey (Electrical Engineering, 2007-08-23)Modeling of deposition processes has become of extreme importance due to the small scale of devices and features as well as the reduction of time to market required by industry. Current modeling procedures have focused ... -
Spectral-Domain Phase-Sensitive Interferometry for Real-Time Probing of Electrodeposition Processes
Chiu, YuJen; 0000-0001-5629-9687 (2018-08-28)Electrodeposition is a simple, versatile and scalable method for depositing thin metal films on conductive substrates, and it has long been used in large-scale industrial processes for metal film coating. In the last two ...