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IMPACT OF MATERIAL MODELS ON IMMERSION COOLED ELECTRONICS PACKAGES AND RELIABILITY ASSESSMENT FOR CHIP-PACKAGE INTERACTION
(2021-05-13)
The immersion cooling for IT equipment has been around for decades. From thermal energy management perspective, immersion cooling is better than traditional cooling technology. However, there is need for more work in open ...
Study of SAC Solder Interconnect Parameters in Microelectronic Semiconductor Packaging and their Effects on Electromigration Failure Mechanisms
(2021-12-13)
As the shrinkage of electronic devices becomes more appealing, so do their high capacity and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend predicted by Moore’s Law. To achieve ...
STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT
(2021-05-09)
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables ...
RELIABILITY ENHANCEMENT OF HETEROGENEOUS 3D INTEGRATED CIRCUIT AND CHARACTERIZATION OF THERMAL INTERFACE MATERIAL
(2020-08-28)
Electronic products require high functional integration in small footprints with lower cost. At the same time, it is required to maintain effective communication between the IC’s and the electronic systems. Various challenges ...
Sub-synchronous resonance analysis and detection
(2019-12-09)
With the increasing penetration of renewable generation resources, power grids have become more susceptible to sub-synchronous resonance phenomena, especially to sub-synchronous control interaction, which produces fast-growing ...
Assessment of Joule Heating Properties of Various Solder Alloys in BGA Assembly
(2023-05-22)
The continuing demands for smaller, yet higher performance devices have resulted in many revolutionary changes in device packaging in recent years, including the change in package form factors, structure, and the type of ...
Analysis of Rater Reliability Using a Faculty Developed, Revised OSCE Evaluation Instrument
(2016-08-12)
Nurse educators need valid and reliable instruments to evaluate student performance during summative clinical experiences and Objective Structured Clinical Examinations (OSCEs). The purpose of this retrospective, secondary ...
SOLDER JOINTS DESIGN OPTIMIZATION OF QFN PACKAGES FOR DIFFERENT BOARDS BY INVESTIGATING SOLDER JOINT RELIABILITY
(2017-05-30)
Quad Flat No-lead package (QFN) is one of the most cutting-edge technologies emerged in the market, exhibiting high performance and efficiency with unparalleled cost effectiveness. QFN, a leadless package, is an ideal ...
Inference about the transition-point in NBUE-NWUE or NWUE-NBUE Models
(University of Texas at Arlington, 1992)
**Please note that the full text is embargoed** ABSTRACT: A life distribution F is called NBUE-NWUE if for some [see pdf for notation], its mean residual life function[see pdf for notation] satisfies e(t) < e(0) for [see ...
Studies of the Performance, Stability and Reliability of Various Configurations of the Activated Sludge Process at Full-Scale Municipal Wastewater Treatment Plants
(Engineering, Environmental, 2009-05-15)
This research presents a performance, stability and reliability analysis of five configurations of activated sludge process, viz., conventional, contact stabilization, complete mix, extended aeration and sequencing batch ...