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IMPACT OF THERMAL AGING ON CRACK GROWTH BEHAVIOR OF LEAD FREE SOLDER INTERCONNECTS
(2018-05-24)
Reliability assessment helps in better performance of electronic packages. This also helps electronic device manufacturing company as well as the users to evaluate the life of any device. The microstructure, mechanical ...
STRUCTURAL OPTIMIZATION & RELIABILITY OF 3D PACKAGE BY STUDYING CRACK BEHAVIOR ON TSV & BEOL & IMPACT OF POWER CYCLING ON RELIABILITY FLIP CHIP PACKAGE
(2018-04-12)
The 3D packaging is stacked of chips on top of another which is emerging as a powerful technology that satisfies such integrated circuit (IC) package demands. Most of the stress develops at interfaces and the interface ...
EFFECT OF PCB THICKNESS ON SOLDER JOINT RELIABILITY OF QFN PACKAGE UNDER POWER AND THERMAL CYCLING
(2017-01-13)
Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When ...
EFFECT OF VISCOELASTIC MODELING OF PCB ON THE BOARD LEVEL RELIABILITY OF WAFER CHIP SCALE PACKAGE (WCSP) IN COMPARISON TO ORTHOTROPIC LINEAR ELASTIC MODELING
(2017-01-13)
The assessment of board level solder joint reliability during thermal cycling is very important for electronic packages. During thermal cycling, the mismatch in Coefficient of Thermal Expansion (CTE) between the materials ...
IMPACT OF MATERIAL MODELS ON IMMERSION COOLED ELECTRONICS PACKAGES AND RELIABILITY ASSESSMENT FOR CHIP-PACKAGE INTERACTION
(2021-05-13)
The immersion cooling for IT equipment has been around for decades. From thermal energy management perspective, immersion cooling is better than traditional cooling technology. However, there is need for more work in open ...