Browsing Theses and Dissertations(library) by Author "Dewan, Rachita"

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3D Interconnects For Die And Wafer Stacks

Dewan, Rachita (Electrical Engineering, 2007-08-23)

3D integration results from the ever demanding trend towards smaller and lower-profile, lighter and lower cost packaged devices requires further package miniaturization. With the present System-on-chip (SOC) technology ...

Browsing Theses and Dissertations(library) by Author "Dewan, Rachita"

3D Interconnects For Die And Wafer Stacks ﻿

3D Interconnects For Die And Wafer Stacks