Browsing Theses and Dissertations(library) by Subject "3D package"
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STRUCTURAL OPTIMIZATION & RELIABILITY OF 3D PACKAGE BY STUDYING CRACK BEHAVIOR ON TSV & BEOL & IMPACT OF POWER CYCLING ON RELIABILITY FLIP CHIP PACKAGE
(2018-04-12)The 3D packaging is stacked of chips on top of another which is emerging as a powerful technology that satisfies such integrated circuit (IC) package demands. Most of the stress develops at interfaces and the interface ... -
STUDY OF CRACK PROPAGATION UNDER THERMAL LOADING ON A 3D TSV PACKAGE
(2016-09-16)Today, there is a revolution in going for miniaturization in size of electronic packages. More thinner, lighter and complex packages are in use for almost every electronic device. This initiation was taken to the next level ...