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Design of flow control device for dynamic cold plate and optimization of servers to decrease junction temperature of heat sinks
(2016-12-19)
Electronics cooling research is facing the challenges of high heat flux removal and increased pumping power. Not much attention has been focused related to server and module level cooling. The continued increase in heat ...
Performance Evaluation of Plate-fin and Pin-fin Heat Sinks for The Application of Oil Immersion Cooling and Design Optimization of Dynamic Cold Plate for The Application of Warm Water Cooling
(2016-05-10)
In IT industries, to keep server rooms and data centers cool is a constant challenge for hardware developers and the cooling solution providers. Air cooling is the most widely used approach for thermal management of servers ...
DESIGN AND PARAMETRIC ANALYSIS OF FLOW CONTROL DEVICE FOR DYNAMIC COLD PLATE TO OPTIMIZE THE TEMPERATURE FLUCTUATIONS OF THE MULTI-CHIP MODULE
(2016-05-10)
Continuing trends of increasing microprocessor power densities and non-uniform temperature distribution pose a significant challenge to the data center cooling. The most usual approach to data center cooling is air cooling ...
Experimental and analytical study of a self-regulated Flow Control Device developed for dynamic cold-plates to cool high-power density multi-chip modules
(2019-11-21)
Modern high-power density modules often demand high amounts of power be
invested in their cooling processes. Uneven heating at the chip level creates hotspots
and temperature gradients across the module. A very effective ...
DESIGN AND CFD ANALYSIS OF BIMETALLIC BASED PASSIVE DYNAMIC COLD PLATE FOR HIGH POWER DIRECT-TO-CHIP LIQUID COOLING
(2021-08-18)
Rising demand for high-performance chips results in the need for advanced and efficient cooling technologies like direct to chip liquid cooling. Cold plates based utilizing direct liquid cooling is one of the most efficient ...
EXPERIMENTAL ANALYSIS VALIDATING A CONTROL SCHEME TO DEVELOP A DYNAMIC COOLING SOLUTION FOR NON-UNIFORM HIGH POWERED ELECTRONIC DEVICES IN DATA CENTER
(2015-12-09)
The trend towards higher heat fluxes and non-uniform power distribution continues as we follow Moore’s law with technology nodes now approaching 10nm. Cooling is always designed for maximum junction temperature and as such ...