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EXPERIMENTAL AND COMPUTATIONAL BOARD LEVEL RELIABILITY ASSESSMENT OF THICK BOARD QFN ASSEMBLIES UNDER POWER CYCLING
(2016-05-11)
Quad Flat No-Lead Package (QFN) is one of the latest cutting edge technologies that took the industry by storm due to its excellent electrical and thermal performance, compact size and low cost. Due to its compact size, ...
SOLDER JOINT DESIGN OPTIMIZATION OF QUAD-FLAT PACKAGE WITH GULLWING LEADS UNDER ACCELERATED THERMAL CYCLING AND POWER CYCLING
(2018-07-10)
Ever growing complexity in designing of Integrated Circuits and accommodating high number of Interconnections in the device is the main source of motivation in today’s world of IC devices. Quad Flat Package (QFP) with ...
RELIABILITY ASSESSMENT OF SOLDER JOINT INTERCONNECTS OF BGA PACKAGE-MEGTRON SERIES UNDER POWER CYCLING
(2017-12-11)
Solder joint interconnects are the second level assembly in surface mount interconnection technology. Mismatch in the coefficient of thermal expansion (CTE) between package and substrate or PCB creates failure in solder ...
EFFECT OF PCB THICKNESS ON SOLDER JOINT RELIABILITY OF QFN PACKAGE UNDER POWER AND THERMAL CYCLING
(2017-01-13)
Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When ...
Solder Ball Reliability Assessment of Wafer Level Chip Scale Package (WLCSP) Through Power Cycling
(2016-12-20)
Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When ...