Search
Now showing items 1-2 of 2
STRUCTURAL OPTIMIZATION & RELIABILITY OF 3D PACKAGE BY STUDYING CRACK BEHAVIOR ON TSV & BEOL & IMPACT OF POWER CYCLING ON RELIABILITY FLIP CHIP PACKAGE
(2018-04-12)
The 3D packaging is stacked of chips on top of another which is emerging as a powerful technology that satisfies such integrated circuit (IC) package demands. Most of the stress develops at interfaces and the interface ...
IMPACT OF MATERIAL MODELS ON IMMERSION COOLED ELECTRONICS PACKAGES AND RELIABILITY ASSESSMENT FOR CHIP-PACKAGE INTERACTION
(2021-05-13)
The immersion cooling for IT equipment has been around for decades. From thermal energy management perspective, immersion cooling is better than traditional cooling technology. However, there is need for more work in open ...