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STRUCTURAL OPTIMIZATION & RELIABILITY OF 3D PACKAGE BY STUDYING CRACK BEHAVIOR ON TSV & BEOL & IMPACT OF POWER CYCLING ON RELIABILITY FLIP CHIP PACKAGE
(2018-04-12)
The 3D packaging is stacked of chips on top of another which is emerging as a powerful technology that satisfies such integrated circuit (IC) package demands. Most of the stress develops at interfaces and the interface ...