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EXPERIMENTAL ANALYSIS VALIDATING A CONTROL SCHEME TO DEVELOP A DYNAMIC COOLING SOLUTION FOR NON-UNIFORM HIGH POWERED ELECTRONIC DEVICES IN DATA CENTER

dc.contributor.advisorAgonafer, Dereje
dc.creatorKokate, Ruturaj Kiran
dc.date.accessioned2017-03-23T15:03:21Z
dc.date.available2017-03-23T15:03:21Z
dc.date.created2015-12
dc.date.issued2015-12-09
dc.date.submittedDecember 2015
dc.identifier.urihttp://hdl.handle.net/10106/26511
dc.description.abstractThe trend towards higher heat fluxes and non-uniform power distribution continues as we follow Moore’s law with technology nodes now approaching 10nm. Cooling is always designed for maximum junction temperature and as such it is important to mitigate hot spots. All cold plates have a static design by nature and do not possess the capability to respond to non-uniform heat dissipation. The unique “dynamic cold plate” concept aims to improving on conventional static designs through implementation of sensing and control, by redistributing the liquid across its body to counter varying power dissipation across the device being cooled.
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.subjectMulti-chip module
dc.subjectDynamic cold plate
dc.subjectNon-uniform power distribution
dc.titleEXPERIMENTAL ANALYSIS VALIDATING A CONTROL SCHEME TO DEVELOP A DYNAMIC COOLING SOLUTION FOR NON-UNIFORM HIGH POWERED ELECTRONIC DEVICES IN DATA CENTER
dc.typeThesis
dc.date.updated2017-03-23T15:03:21Z
thesis.degree.departmentMechanical and Aerospace Engineering
thesis.degree.grantorThe University of Texas at Arlington
thesis.degree.levelMasters
thesis.degree.nameMaster of Science in Mechanical Engineering
dc.type.materialtext


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