THERMAL MANAGEMENT OF HIGH POWER MULTI CHIP MODULE BY DESIGN OPTIMIZATION OF SEGREGATED SERPENTINE FLOW COLD PLATE

Abstract

Data center environment cooling requirements became a challenge with rapid increasing microprocessor power densities which leads to non-uniform distribution of temperature. A practical cooling solution which relies on the segregated flow of cooling resources based on power density for thermal management of high power equipment is introduced. This minimizes energy consumption of cooling infrastructure. Performance of existing cold plate is previewed and amount of savings possible is shown from numerical analysis of segregated model. Model is designed by considering manufacturing feasibility to make samples for proposed solution for future experimental study. A multi-chip module is chosen as a base for design of solution. Details of design and modelling of analysis was included. The designed segregated model reported low Thermal impedance and less pumping power requirement and uniform temperature distribution across the MCM. Advantage of scalability for Various foot prints of multi-chip microprocessor.