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dc.contributor.authorKaringada, Arun Thomasen_US
dc.date.accessioned2011-07-14T20:48:19Z
dc.date.available2011-07-14T20:48:19Z
dc.date.issued2011-07-14
dc.date.submittedJanuary 2011en_US
dc.identifier.otherDISS-11143en_US
dc.identifier.urihttp://hdl.handle.net/10106/5654
dc.description.abstractSilicon Germanium (SiGe) hetero junction bipolar transistors (HBTs) are used in a variety of circuits like analog mixed signal and RF(radio frequency ) circuits. As the device gets smaller these days the self heating affects the performance of the SiGe HBTs. This paper uses theoretical methods based on device geometry and material properties to calculate the thermal resistance and thermal capacitance of SiGe HBT. In addition to theoretical estimations time domain, frequency domain and DC measurements are done on National Semiconductor's CBC8 HBTs which is used to extract the values of thermal impedance parameters.en_US
dc.description.sponsorshipCarter, Ronald L.en_US
dc.language.isoenen_US
dc.publisherElectrical Engineeringen_US
dc.titleEstimation Of Thermal Impedance Parameters Of Silicon Germanium Heterojunction Bipolar Transistorsen_US
dc.typeM.S.en_US
dc.contributor.committeeChairCarter, Ronald L.en_US
dc.degree.departmentElectrical Engineeringen_US
dc.degree.disciplineElectrical Engineeringen_US
dc.degree.grantorUniversity of Texas at Arlingtonen_US
dc.degree.levelmastersen_US
dc.degree.nameM.S.en_US


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