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Design of flow control device for dynamic cold plate and optimization of servers to decrease junction temperature of heat sinks
(2016-12-19)
Electronics cooling research is facing the challenges of high heat flux removal and increased pumping power. Not much attention has been focused related to server and module level cooling. The continued increase in heat ...
EXPERIMENTAL AND COMPUTATIONAL BOARD LEVEL RELIABILITY ASSESSMENT OF THICK BOARD QFN ASSEMBLIES UNDER POWER CYCLING
(2016-05-11)
Quad Flat No-Lead Package (QFN) is one of the latest cutting edge technologies that took the industry by storm due to its excellent electrical and thermal performance, compact size and low cost. Due to its compact size, ...
CFD Analysis and Design Optimization of Heat Sink for Oil Immersion Cooling
(2016-05-11)
Air cooling is predominant cooling technique employed in most of the data centers. As the demand for High performance computing (HPC) which deploy large concentration of high-end servers (30 kW to 200 kW per rack) is ...
CHARACTERIZING CONTAMINATION TO EXPAND ASHRAE ENVELOPE IN AIRSIDE ECONOMIZATION AND THERMAL AND RELIABILITY IN IMMERSION COOLING OF DATA CENTERS
(2018-08-24)
The Datacom facility which comprises rooms or closets used for communication, computers/servers or electronic equipment requires cooling unit which consumes 31% (23% HVAC cooling + 8% HVAC fans) of overall energy. The ...
STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT
(2021-05-09)
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables ...
Computational Analysis of Enhancing Heat Transfer in a 3-D stacked Die Using Different Finned Heat Sink
(2015-12-08)
3D die stacking is an exciting new technology that increases the transistor’s density by integrating two or more dies vertically with a dense high – speed interface. The result of 3D die stacking is a significant reduction ...